![]() ![]() AMD uses dummy chiplets as structural reinforcement in some of its EPYC server processors. We don't know if they've disabled two of the six MCDs, or whether they're dummies. What's interesting is that the 5 nm GCD is still surrounded by six 6 nm MCDs. It is a square package, compared to the larger rectangular one, and has a significantly thinner metal reinforcement brace. The new smaller "Navi 31" package is visibly smaller than the one powering the RX 7900 XT/XTX. ![]() We compared the sizes of the new "Navi 31" package found in the RX 7900 GRE, with those of the regular "Navi 31" powering the RX 7900 XT/XTX, the previous-generation "Navi 21" powering the RX 6900 XT, and the NVIDIA AD103 silicon powering the desktop GeForce RTX 4080. AMD wouldn't go through all the effort designing a first-party MBA (made by AMD) PCB for the silicon just for the RX 7900 GRE, and so this PCB, with this particular version of the "Navi 31" silicon, could see a wider global launch, probably as the rumored Radeon RX 7800 XT, or something else (although with a different set of specs from the RX 7900 GRE). AMD wouldn't go through all that effort designing a whole different GPU just for a limited edition graphics card, which means this silicon could find greater use for the company-for example, this could be the package AMD uses for its upcoming mobile RX 7900 series. It is a physically different GPU from the one found in desktop Radeon RX 7900 XT and RX 7900 XTX graphics cards. The GPU at the heart of the China-exclusive AMD Radeon RX 7900 GRE (Golden Rabbit Edition) sparked much curiosity.
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